The principle of plasma cleaning, it is said that the operating cost of using a plasma cleaning system is relatively low. Is this true? Low temperature plasma cleaning equipment can not only provide the highest quality clean surface, but also enhance surface adhesion,

What are the differences between argon oxygen plasma cleaning technology and other gases?

The principle of argon oxygen plasma cleaning technology should include the generation of plasma, the respective roles of argon and oxygen. Argon is usually used for physical cleaning to remove surface impurities through plasma bombardment, while oxygen may be used for chemical cleaning to oxidize organic matter. It is necessary to explain the ionization process of plasmons under the action of an electric field, and how these two gases work together.

How effective is the argon oxygen plasma cleaning machine in improving surface cleanliness, enhancing adhesion, and changing surface roughness? Today, let's delve deeper into the analysis and understand:

1. Argon oxygen plasma cleaning technology can perform ultra-fine surface cleaning on product surfaces. Atmospheric pressure plasma cleaning equipment is a method of removing organic and microbial surface pollutants, which can enhance surface firmness and adhesion.

When the strength is high, it can also remove weak surface boundary layers, crosslink surface molecules, and even reduce surface oxides.

2. The argon oxygen plasma cleaning machine can be applied to various manufacturing fields. The product is treated with argon oxygen plasma cleaning technology before bonding, coating, and painting, which can improve surface adhesion. It uses hydrogen, nitrogen, and oxygen for operation, but avoids wet chemical methods and expensive vacuum equipment, which has a positive impact on its cost, safety, and environmental impact.

Argon oxygen plasma treatment technology stands out as an effective surface cleaning and modification technique, capable of removing organic impurities and enhancing the hydrophilicity of silicon wafers and polymer materials. Oxygen plasma contains a variety of highly active species, including ionized ozone. When these components recombine under specific conditions or are exposed to UV radiation, they produce significant effects. As the gaseous species in oxygen plasma interact with the material surface, they break the C-C and C-H bonds, effectively decomposing organic pollutants. After removing pollutants, the species in oxygen plasma react with free radicals generated on the surface, resulting in the grafting of oxygen-containing functional groups (such as carbonyl (C=0), carboxyl (- COOH), and hydroxyl (-0H)) onto the surface. Therefore, the surface becomes highly polar and hydrophilic. Different types of plasma cleaning technologies are also specifically designed to meet specific needs. Let's explore the advantages of argon oxygen plasma cleaning machines one by one:

1. For silicon wafers, argon plasma cleaning involves reactive species colliding with the silicon surface to remove organic pollutants and replace surface atoms with oxygen-containing functional groups, greatly enhancing the polarity and hydrophilicity of the surface.

After treatment with an oxygen plasma cleaning machine, the surface hydrophilicity is significantly enhanced,

2. The main advantages of argon oxygen plasma cleaning technology are its convenience and speed. As it does not require a vacuum chamber, it can handle large and irregularly shaped objects and is easy to integrate into production lines for continuous manufacturing processes.

3. The process of argon oxygen plasma cleaning machine can quickly cover a large area and is suitable for fast-paced industries. In these industries, atmospheric plasma treatment technology can be widely applied to multiple industries due to its wide applicability, such as automotive, electronics, textile and packaging fields.

4. The most significant advantage of argon oxygen plasma cleaning machine lies in its precision and uniformity. Under low pressure conditions, the active species in the plasma can be evenly distributed on the surface, and even effectively penetrate the smallest surface features. This makes the processing results consistent and of high quality, making it an ideal choice for situations that require fine processing, such as etching complex patterns on semiconductors or activating the surface of small medical devices.

If you need to learn about other series of plasma cleaning machines, plasma cleaning machines can help improve bonding effects and enhance the printing performance of materials. Welcome to private chat with Zhenyi Co., Ltd.'s friends!