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Common characteristics and widely applied fields of plasma cleaning technology

source:本站author:超級管理員time:2025-05-19views:9659909

Choosing plasma cleaning equipment usually refers to some data, such as plasma parameters, including ion energy, ion flux, plasma density, electron temperature, RF power, what is plasma etching, plasma deposition, and plasma surface activation. Today, please follow the editor to learn more:


1. Plasma etching (such as reactive ion etching, deep reactive ion etching, and ion beam etching), plasma is a state of matter composed of a large number of charged particles (such as electrons and ions) and neutral particles. In the plasma etching process, gas (such as hydrogen fluoride, carbon tetrafluoride, etc.) is first introduced into the vacuum chamber and excited into plasma by an energy source such as radio frequency power or microwave. Active particles (such as free electrons, ions, radicals, etc.) in plasma accelerate and collide with the surface of the material to be processed under the action of an electric field, thereby achieving material removal (etching).


2. Plasma deposition (such as plasma enhanced chemical vapor deposition, physical vapor deposition, atomic layer deposition, and magnetron sputtering) is a process that uses plasma technology to deposit thin films on substrate surfaces. It combines the high-energy characteristics of plasma with thin film deposition technology to achieve the preparation of high-quality and high-performance thin films.

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3. Plasma surface activation (such as plasma cleaning, plasma polymerization, plasma oxidation, plasma nitriding, plasma hydrogenation, and activation of plasma and rare gases) is a technique that uses high-energy particles (such as electrons, ions, free radicals, etc.) in plasma to change the chemical and physical properties of material surfaces. It enhances the reactivity, wettability, adhesion, or biocompatibility of materials by introducing active groups, changing surface energy, and increasing surface roughness.


Although plasma cleaning machines have three different functions, their reasons all have the following characteristics:


1. High efficiency: Plasma activation can significantly change the surface properties of materials in a short period of time, with processing times typically ranging from a few minutes to several tens of minutes.

2. Solvent free treatment: Compared with traditional chemical treatment methods, plasma cleaning technology does not require the use of liquid solvents, avoiding solvent residue and environmental pollution problems.

3. Low temperature treatment: Many plasma activation processes can be carried out at lower temperatures (usually below 100 ℃), suitable for temperature sensitive materials such as plastics, biomaterials, etc.

4. Uniformity: Active particles in the plasma can uniformly act on the surface of the material, achieving large-area and uniform surface modification.

5. Controllability: By adjusting parameters such as gas composition, pressure, power, and processing time of the plasma, the degree and effect of surface modification can be precisely controlled.

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In addition, plasma cleaning equipment is widely used in the following fields:


1. Semiconductor manufacturing: used for depositing insulating layers, conductive layers, protective layers, etc., such as thin films of silicon dioxide, silicon nitride, polycrystalline silicon, etc.

2. Thin film field: Manufacturing structural thin films in microsensors and microactuators, such as silicon thin films, metal thin films, etc.

3. Optical field: Preparation of optical coatings, such as glass, reflective films, anti reflective films, spectral films, etc.

4. Energy field: used for preparing electrodes for solar cells, electrolyte layers for thin-film cells, etc.

5. Metal field: Clean and activate the surface of metals and other materials to improve their adhesion with adhesives and coatings.

6. In the field of textile fibers, plasma cleaning technology can improve the wettability of textiles and is used in dyeing, coating and other processes.

7. Biomedical field: Plasma cleaning technology can improve the surface biocompatibility of biomaterials and reduce tissue rejection reactions.

8. Automotive manufacturing industry: Plasma cleaning technology can improve the surface performance of automotive components, enhance the adhesion and durability of coatings.


In summary, today's information mainly revolves around the fact that plasma cleaning machines not only have conventional cleaning functions, but also have plasma etching, plasma deposition, and plasma surface activation functions, as well as the common characteristics and widely used fields of plasma cleaning technology. Plasma cleaning machines can use high-energy particles in plasma to bombard material surfaces, remove surface pollutants and oxide layers, and increase surface roughness, thereby improving surface energy and wettability.


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