The application of vacuum plasma cleaning machine in PCB manufacturing process!

It is said that there will be residues such as soldering flux, oil stains, fingerprints, dust, and oxides in the production process of circuit boards. If these pollutants are not removed in time, they will affect the soldering quality of components in the subsequent process. How to use plasma cleaning technology to remove surface pollutants.

Vacuum plasma cleaning machine is a dry and environmentally friendly technology suitable for the printed circuit board and electronic component assembly industry. It is a mature technology that can be used to remove residues left by laser drilling. Today, let's learn together about the effect of plasma cleaning treatment before PCB soldering.

Through low-temperature plasma treatment, the chemical structure of the PCB surface will change, introducing polar groups to change the surface from hydrophobic to hydrophilic, thereby improving the wettability of the surface. Good wettability helps to evenly spread the soldering material on the PCB surface, improve the reliability of soldering, and reduce defects such as virtual soldering and solder leakage. 

At the same time, it is also beneficial for the uniform coating of materials such as coatings and solder resist in subsequent coating processes, thereby improving the adhesion and protective performance of the coating.

Normally, vacuum plasma activation treatment of printed circuit boards before casting and packaging can enable etching and demolding of PTFE printed circuit boards, thereby removing surface oxides. On the one hand, vacuum plasma treatment can remove surface pollutants, making the surface cleaner and rougher; On the other hand, changes in surface chemical properties also enable stronger chemical bonds to form between the surface and subsequent adhesive materials, significantly enhancing adhesion. High energy particles in plasma interact with atoms or molecules on the surface of PCB, breaking the chemical bonds on the surface and forming highly active free radicals or unsaturated bonds, which activate the surface.

The activated surface of plasma cleaning machine is more prone to chemical reactions with other substances. In subsequent electroplating, chemical plating and other processes, it can improve the deposition rate and uniformity of metal ions on the surface, thereby obtaining better coating quality and improving the packaging quality of PCB surface.

Plasma cleaning technology can quickly clean residues and contaminants on printed circuit boards (PCBs), enhance surface adhesion of electronic components, such as cleaning before chip packaging, promote the reliability of soldering and bonding processes, and thereby remove organic pollutants and particles on the wafer surface,

The vacuum plasma cleaning machine can effectively remove organic pollutants, oxides, and other impurities on the surface of materials by generating plasma in a vacuum environment, while improving the hydrophilicity and adhesion of the surface. This makes it one of the key devices in many high-precision and high demand industries.