How does a plasma cleaning machine clean residues on the surface of circuit boards!

Firstly, let's understand the principle of plasma surface cleaning machine, which is a device that uses plasma to clean residual substances on the surface of objects. Plasma is a partially ionized gas composed of ions, electrons, free radicals, and neutral particles. It is generated by ionizing gases by applying high-frequency electric fields or microwave energy in specific gas environments such as oxygen, hydrogen, argon, etc. When gas is ionized, it forms a highly active plasma state.

These highly active plasma particles undergo physical and chemical reactions with residues on the surface of objects, thereby achieving the purpose of cleaning. For example, when cleaning oil stains on metal surfaces, active particles in the plasma can react with oil molecules to decompose them into small molecules and remove them.

The application of plasma surface cleaning machine in the PCB/FPC industry is very extensive, mainly reflected in the following aspects:

1、 Circuit board cleaning: The plasma surface cleaning machine can deeply clean the circuit board, removing dirt, grease, oxides and other pollutants from the surface of the circuit board. These pollutants may affect the conductivity, soldering performance, and reliability of the circuit board. Through plasma cleaning, the quality and performance of the circuit board can be effectively ensured.

2、 Pre treatment of PCB: Surface activation: Plasma cleaning machine can increase the hydrophilicity of the PCB surface, making it easier to wet and solder, thereby improving the soldering performance and reliability. Plasma cleaning machines can remove carbides: In processes such as laser drilling, carbides may form on the surface of circuit boards. Plasma cleaning machines can effectively remove these carbides, avoiding their impact on subsequent processes. Plasma cleaning technology can also remove residual glue: various adhesives may be used during the production process of circuit boards. The plasma cleaning machine can completely remove residual glue and avoid affecting the performance of the circuit board.

3、 Improving process yield: Enhancing the reliability of hole metallization: For soft hard bonding plates and multi-layer flexible plates, plasma cleaning machines can remove contaminants from the hole walls and between layers, improving the reliability of hole metallization. Improving adhesion: The plasma cleaning machine can activate the surface of the circuit board, enhance the adhesion between the circuit laminates, and improve the adhesion between the hole wall and the copper plating layer. Improving the reliability of solder joints: Performing plasma cleaning on the PCB before BGA mounting can enhance the reliability of solder joints, reduce solder defects, and improve mounting yield.

4、 Environmental Protection and Efficiency: Environmental Protection: Plasma cleaning equipment is a dry treatment process that does not use chemical solvents, avoiding environmental pollution and health risks to operators. Plasma cleaning machines can clean the surface of circuit boards in a short period of time, with fast processing speed and suitable for large-scale production.

5、 Application examples

1. HDI board processing: Plasma cleaning equipment can remove carbides formed after laser drilling, etch and activate via holes, and improve the yield and reliability of PHT process.

2. FPC board processing: The removal of residual glue from the hole walls of multi-layer soft boards, the cleaning and activation of reinforcement material surfaces, and the decomposition of carbides formed by laser cutting of gold fingers can all be achieved through plasma surface treatment technology.

3. Soft hard bonding plate treatment: Vacuum plasma technology can remove pollutants from the hole walls and between layers, improve the reliability of hole metallization in soft hard bonding plates, and enhance the bonding strength between circuit layers. Through vacuum plasma technology, the hole walls and material surfaces can be activated to improve the bonding strength between the hole walls and the copper plating layer.

4. Wire bonding: Before bonding the chip to the substrate, plasma cleaning equipment can significantly improve surface activity, enhance the bonding strength and tensile strength of the bonding wire, reduce the pressure and temperature of the solder joint, and improve production efficiency.

In summary, the application of plasma surface cleaning machines in the circuit board industry is widespread and important. Plasma cleaning machines can not only improve the quality and performance of circuit boards, but also enhance process yield and production efficiency, while meeting environmental protection requirements.