What are the common application areas of vacuum low-temperature plasma processing machines?

What are the changes after chip cleaning and pretreatment with the help of low-temperature plasma processing machine?

The bonding between chips and packaging substrates is often composed of two materials with different properties. The surface of materials often exhibits hydrophobicity and inertness, with poor surface adhesion performance. Due to the easy occurrence of gaps at the interface during bonding, it poses great difficulties for the integrated I after packaging. Nowadays, plasma cleaning technology can be applied to the surface of integrated circuits and chip packaging substrates, which can effectively enhance their surface activity.

Plasma cleaning technology can change the fluidity of epoxy resin adhesive surface, increase the adhesion between integrated circuits and packaging substrates, reduce product delamination, improve thermal conductivity, and vacuum cleaning technology can enhance the reliability and stability of IC packaging, extending product life.

For chip packaging, integrated circuits processed by low-temperature plasma cleaning machines can not only obtain ultra pure welding surfaces, but also greatly improve their surface activity, effectively prevent virtual welding, reduce cracks, enhance reliable welding of parts, increase the edge height and packaging capacity of fillers, and enhance the mechanical strength of packaging. Due to the thermal expansion coefficient of different materials during drying, the internal stress between interfaces decreases, resulting in increased reliability and lifespan of the product.

With the help of surface activation treatment in low-temperature plasma cleaning machines, lead frames still account for more than 80% in the field of microelectronic devices. Copper alloy materials with good thermal conductivity, conductivity, and processing performance are mainly used as lead frames. Through plasma cleaning machines, ultra purification and activation of the surface of lead frames can be achieved.

The application of plasma cleaning machines in the field of chips has the following significant advantages and characteristics:

1. Improve chip yield and performance: Plasma cleaning machines can effectively remove organic and inorganic impurities such as photoresist, flux, metal salts, etc. on the surface of wafers, chips, and other devices, thereby ensuring the performance and stability of the devices.

2. Non contact cleaning: The non-contact characteristics of plasma cleaning technology eliminate scratches, deformations, and other damages that may be caused by traditional mechanical cleaning, especially suitable for precision components that require extremely high surface quality.

3. Uniform cleaning effect without dead corners: Plasma can penetrate into small gaps and complex structures on the surface of materials to achieve comprehensive and uniform cleaning effect, ensuring consistency in cleaning quality.

4. Ability to handle complex shapes and microstructures: Whether it's tiny holes, grooves, or complex surfaces, plasma cleaning technology can easily handle them, providing strong support for precision manufacturing.

5. Environmentally friendly and pollution-free: This technology avoids the use of chemical cleaning agents, reduces the generation of harmful waste liquids, conforms to the development trend of green production, and reduces the environmental pressure on enterprises.

6. Wide expansion of application fields: In the semiconductor manufacturing field, plasma cleaning technology is widely used in wafer cleaning, packaging pre-treatment and other processes, effectively removing pollutants such as dust and metal ions on the wafer surface, and improving the quality and yield of chips.

7. Improve packaging quality and product performance: In the field of semiconductor packaging, plasma cleaning technology can effectively solve various problems caused by pollutants during the packaging process, and improve packaging quality and product performance.

8. Optimize wire bonding: The plasma cleaning machine can significantly improve the surface activity of wire bonding, thereby enhancing the bonding strength of the workpiece and the uniformity of the tension of the bonding wire.